Semiconductor Back-End Manufacturing - Part 1
Master all process steps of the semiconductor back-end manufacturing - Part 1 - Taping, Grinding, Peeling, Testing
Updated on Mar, 2026
Language - English
Teaching and Academics ,Engineering,Electrical Engineering
Lectures -5
Duration -2.5 hours
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Course Description
Mastering Semiconductor Back-End Manufacturing: From Fundamentals to Advanced Techniques
Join me in unlocking the secrets of semiconductor back-end manufacturing with this comprehensive course. Designed for beginners and professionals alike, this course dives deep into semiconductor fabrication, focusing on the critical back-end processes that transform silicon wafers into powerful, high-performance chips.
What You Will Learn
Core Principles
Understand the foundational concepts of back-end semiconductor manufacturing.
Advanced Techniques
Explore up-to-date industry techniques and best practices.
Process Integration
Follow a step-by-step guide to wafer back-end manufacturing, from taping to final packaging.
Quality Control
Learn how high-quality and reliable chips are produced.
Why Take This Course
Expert Instruction
Learn from an industry expert with real-world experience.
Real-World Applications
Gain practical knowledge based on current and emerging technologies.
Engage in multimedia lectures, in-depth case studies, and hands-on projects.
This course delivers the skills that you and your organization need today to succeed in the semiconductor industry. Whether you want to advance your career, break into the semiconductor field, or broaden your technical knowledge base, this course provides the tools and expertise needed to move forward. Enroll now and take your first steps toward becoming an expert in semiconductor manufacturing.
Goals
- Gaining detailed insights into semiconductor back-end manufacturing.
- Understanding all the process steps necessary for semiconductor back-end manufacturing.
- Guidance through every single process, necessary for understanding semiconductor manufacturing.
- Explaining all the steps necessary to create a semiconductor application.
Prerequisites
- Basic knowledge about semiconductors and manufacturing.
Curriculum
Check out the detailed breakdown of what’s inside the course
Introduction
1 Lectures
-
Introduction
25:34
25:34
Taping
1 Lectures
Grinding
1 Lectures
Peeling
1 Lectures
Testing
1 Lectures
Instructor Details
Tobias Lepiarczyk
My name is Tobias and I am working since 7+ years in the semiconductor industry, mainly focusing on the back-end wafer manufacturing process. After graduating from university with a M. Sc. degree in industrial engineering, focusing on electrical engineering and manufacturing, I entered the exciting and fast pacing cutting edge semiconductor industry and have not left since. My area of expertise involves the whole semiconductor manufacturing process with focus on the back-end manufacturing process steps like taping, grinding, peeling, testing, mounting, singulation and packaging.
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