Semiconductor Back-End Manufacturing - Part 1
Master all process steps of the semiconductor back-end manufacturing - Part 1 - Taping, Grinding, Peeling, Testing
Updated on Jun, 2025
Language - English
Teaching and Academics ,Engineering,Electrical Engineering
Lectures -5
Duration -2.5 hours
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Course Description
Mastering Semiconductor Back-End Manufacturing: From Fundamentals to Advanced Techniques
Join me in unlocking the secret of semiconductor back-end manufacturing with this comprehensive course on Udemy! Designed for beginners and veterans alike, the course really dives deep into the world of semiconductor fabrication, focusing specifically on the critical back-end processes that transform silicon wafers into powerful, high-performance chips.
Core Principles: Understand the foundational concepts of back-end semiconductor manufacturing.
Advanced Techniques: Up-to-date industry techniques and best practices.
Process Integration: Step-by-step guide on how all wafer back-end manufacturing steps from taping up to final packaging are done.
Quality Control: How high-quality and reliable chips are made.
Why should you take this course?
Expert Instruction: Let an industry expert teach you with real-world experience.
Real-World Applications: Practical knowledge based on current and emerging technology.
Engage in multimedia lectures, in-depth case studies, and hands-on projects.
This course delivers the skills that you and your organization need today to be successful in the semiconductor industry. Want to advance in your career? Are you trying to break into the semiconductor field? Want to have a broader technical knowledge base? This course is where it is all at-this is all the tools and expertise you need to be successful. Enroll now and take your first steps toward the expert semiconductor manufacturing professional.
Goals
- Gaining detailed insights in semiconductor back-end manufacturing
- Understanding all the process steps, necessary for semiconductor back-end manufacturing
- Guidance through every single process, necessary for understanding semiconductor manufacturing
- Explaining all the steps, necessary to create a semiconductor application.
Prerequisites
- Basic knowledge about semiconductor and manufacturing
Curriculum
Check out the detailed breakdown of what’s inside the course
Introduction
1 Lectures
-
Introduction
25:34
25:34
Taping
1 Lectures
Grinding
1 Lectures
Peeling
1 Lectures
Testing
1 Lectures
Instructor Details
Tobias Lepiarczyk
My name is Tobias and I am working since 7+ years in the semiconductor industry, mainly focusing on the back-end wafer manufacturing process. After graduating from university with a M. Sc. degree in industrial engineering, focusing on electrical engineering and manufacturing, I entered the exciting and fast pacing cutting edge semiconductor industry and have not left since. My area of expertise involves the whole semiconductor manufacturing process with focus on the back-end manufacturing process steps like taping, grinding, peeling, testing, mounting, singulation and packaging.
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