The Semiconductor Environment - Part 6
Part 6: Advanced Semiconductor Materials and Technologies
Teaching and Academics ,Engineering,Electrical Engineering
Lectures -16
Duration -56 mins
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Course Description
There is a great 7-part course on Udemy that will open you up to the semiconductor world. Indeed very well crafted, promising to take you through all of the semiconductor business from physics fundamentals to the latest technologies and business strategies.
We take you on a journey through "Fundamentals of Semiconductor Physics" in Part 1, where we painstakingly untangle the behavior of electrons, energy bands and the principles at work behind these marvelous materials. By the end of it, you shall have good, solid knowledge that will form the rock foundation on which semiconductor knowledge is built.
Part 2 is "Business Models in Semiconductors". See how an individual company fits into the larger economic tapestry of the industry. Understand just how firms position themselves for success in this high-stakes, fast-moving market.
Parts 3 and 4 discuss critical elements of semiconductor production. "Hard Production Necessities" introduces you to complex processes and equipment for the production of such tiny technological wonders. Meanwhile, "Auxiliary Production Necessities" complements the knowledge dealing with supporting systems and infrastructure of such easy-flow production.
Part 5 details the many "Roles2 in the semiconductor industry. Read on to see all that you can do and how you will succeed in this high-tech field.
Part 6 - Advanced Semiconductor Materials and Technologies: Here you'll learn at the front edge of newness, from novel materials through emerging fabrication techniques, on the future of semiconductor technology.
The last section is "Semiconductor Reliability and Failure Analysis," in which such critical aspects of quality control and product improvement come to be discussed. Learn how to keep semiconductor devices for a long time in terms of performance by techniques like this.
As a result of this course, you will be well-equipped with comprehensive understanding from the atomic level to overall industry-wide trends by the end of this course. You, as a student, will understand your semiconductor environment; as a professional or an enthusiast of technology, you will gain knowledge and insights to navigate this fascinating world of semiconductors.
Goals
- Gain insights into the factors that limit or enable semiconductor device improvements
- Learn about cutting edge technologies like EUV lithography, TAIKO, DBG, SD, Advanced Packaging (2.5D, 3D, Interposer, HBM, TSV, UBM, RDL) and more
- Understand the interdependencies between different technologies
- Learn about Moore`s law and how this defines semiconductor improvement actions
Prerequisites
- Interest in electronics and semiconductors

Curriculum
Check out the detailed breakdown of what’s inside the course
Introduction
1 Lectures
-
Introduction 01:12 01:12
Moore`s law
1 Lectures

How to increase semiconductor device performance
1 Lectures

EUV lithography
1 Lectures

TAIKO
1 Lectures

DBG (Dicing before grinding)
1 Lectures

SD (Stealth dicing)
1 Lectures

Advanced semiconductor materials (SiC, GaN)
1 Lectures

Introduction into advanced packaging
1 Lectures

SoC (System on chip)
1 Lectures

SiP (System in package) and flip-chip technology
1 Lectures

Interposer
1 Lectures

2.5D and 3D packaging
1 Lectures

WLP (Wafer level packaging)
1 Lectures

HBM (High bandwidth memory)
1 Lectures

Key takeaways
1 Lectures

Instructor Details

Tobias Lepiarczyk
My name is Tobias and I am working since 7+ years in the semiconductor industry, mainly focusing on the back-end wafer manufacturing process. After graduating from university with a M. Sc. degree in industrial engineering, focusing on electrical engineering and manufacturing, I entered the exciting and fast pacing cutting edge semiconductor industry and have not left since. My area of expertise involves the whole semiconductor manufacturing process with focus on the back-end manufacturing process steps like taping, grinding, peeling, testing, mounting, singulation and packaging.
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