The Semiconductor Environment - Part 7
Part 7: Semiconductor Reliability and Failure Analysis
Teaching and Academics ,Engineering,Electrical Engineering
Lectures -19
Duration -1 hours
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Course Description
Join a journey of discovery into the world of semiconductors with our comprehensive 7-part program on Udemy. This carefully designed course will take you through the entire semiconductor industry, from physics to cutting-edge technologies and business strategies.
Part 1 - Principles of Semiconductor Physics
Untangling the mystery of electron behaviour, energy bands, and the principles underlying this material miracle. You will have a solid foundation that will be your bedrock for semiconductor knowledge.
Part 2 - Semiconductor Business Models
An area of incredibly valuable insight into how the industry produces in terms of its economic landscape. Learn about the high stakes and fast pace of these companies in the market and how to position them for success.
Part 3 - Hard Production Necessities
Comprehensive processes and equipment for producing these tiny technological marvels.
Part 4 - Auxiliary Production Necessities
Supporting systems and infrastructure that make production possible.
Part 5 - Roles in the Semiconductor Industry
Discover the richness and diversity of careers and skills that can help you excel in this exciting field.
Part 6 - Advanced Semiconductor Materials and Technologies
Keeping you updated about the most recent developments, new materials, and novel techniques in fabrication so that you can understand what is in store for the future of semiconductor technology.
Part 7 - Semiconductor Reliability and Failure Analysis
One of the critical areas of quality control is enhancing the product. Learn many different methods for reliability and failure analysis of semiconductor devices.
By the end of this course, you will learn about the semiconductor environment from atomic-level concepts to industry-wide trends. Whether you are a student, professional, or technology enthusiast, this course provides critical knowledge and insight into the fascinating world of semiconductors.
Goals
- Understanding the basics of semiconductor reliability and failure analysis.
- Gaining detailed insights into non-destructive and destructive failure analysis methods.
- Dive deep into non-destructive techniques like optical microscopy, PIND test, electrical failure analysis, EDS, X-ray microscopy, SAM and hermiticity testing
- Learn about destructive techniques like decapsulation, cross-sectioning, hot spot detection, microprobing, SEM and TEM, elemental analysis and FTIR spectroscopy.
Prerequisites
- Interest in electronics and semiconductors.
Curriculum
Check out the detailed breakdown of what’s inside the course
Introduction
1 Lectures
-
Introduction 01:14 01:14
Importance of semiconductor reliability, quality and failure analysis
1 Lectures
Process flow of failure analysis
1 Lectures
Visual inspection (optical microscopy)
1 Lectures
Particle impact noise detection (PIND) test
1 Lectures
Electrical failure analysis
1 Lectures
Energy-dispersive spectroscopy (EDS)
1 Lectures
X-ray microscopy
1 Lectures
Scanning acoustic microscopy (SAM)
1 Lectures
Hermeticity testing
1 Lectures
De-lidding/Decapping
1 Lectures
Cross sectioning
1 Lectures
Hot spot detection
1 Lectures
Microprobing
1 Lectures
Scanning electron microscopy (SEM) and transmission electron microscopy (TEM)
1 Lectures
Elemental analysis
1 Lectures
FTIR spectroscopy
1 Lectures
Focused ion beam
1 Lectures
Summary
1 Lectures
Instructor Details
Tobias Lepiarczyk
My name is Tobias and I am working since 7+ years in the semiconductor industry, mainly focusing on the back-end wafer manufacturing process. After graduating from university with a M. Sc. degree in industrial engineering, focusing on electrical engineering and manufacturing, I entered the exciting and fast pacing cutting edge semiconductor industry and have not left since. My area of expertise involves the whole semiconductor manufacturing process with focus on the back-end manufacturing process steps like taping, grinding, peeling, testing, mounting, singulation and packaging.
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